JPH06823Y2 - 半導体ウエハの補強用当板 - Google Patents
半導体ウエハの補強用当板Info
- Publication number
- JPH06823Y2 JPH06823Y2 JP1989088651U JP8865189U JPH06823Y2 JP H06823 Y2 JPH06823 Y2 JP H06823Y2 JP 1989088651 U JP1989088651 U JP 1989088651U JP 8865189 U JP8865189 U JP 8865189U JP H06823 Y2 JPH06823 Y2 JP H06823Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- contact plate
- cut
- cutting
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 57
- 230000003014 reinforcing effect Effects 0.000 title claims description 9
- 235000012431 wafers Nutrition 0.000 claims description 66
- 238000005520 cutting process Methods 0.000 claims description 22
- 230000002093 peripheral effect Effects 0.000 claims description 17
- 239000012535 impurity Substances 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989088651U JPH06823Y2 (ja) | 1989-07-27 | 1989-07-27 | 半導体ウエハの補強用当板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989088651U JPH06823Y2 (ja) | 1989-07-27 | 1989-07-27 | 半導体ウエハの補強用当板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0327041U JPH0327041U (en]) | 1991-03-19 |
| JPH06823Y2 true JPH06823Y2 (ja) | 1994-01-05 |
Family
ID=31638252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989088651U Expired - Lifetime JPH06823Y2 (ja) | 1989-07-27 | 1989-07-27 | 半導体ウエハの補強用当板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06823Y2 (en]) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5318951A (en) * | 1976-08-06 | 1978-02-21 | Hitachi Ltd | Production of semiconductor device |
| JPS5761715A (en) * | 1980-09-29 | 1982-04-14 | Teijin Ltd | Pulp-like particles |
-
1989
- 1989-07-27 JP JP1989088651U patent/JPH06823Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0327041U (en]) | 1991-03-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |